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MMDF2P02E
Power MOSFET
2 Amps, 25 Volts
P ? Channel SO ? 8, Dual
These miniature surface mount MOSFETs feature ultra low R DS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain ? to ? source diode has a low reverse recovery time. These devices
are designed for use in low voltage, high speed switching applications
where power efficiency is important. Typical applications are dc ? dc
converters, and power management in portable and battery powered
products such as computers, printers, cellular and cordless phones.
They can also be used for low voltage motor controls in mass storage
products such as disk drives and tape drives. The avalanche energy is
specified to eliminate the guesswork in designs where inductive loads
are switched and offer additional safety margin against unexpected
voltage transients.
http://onsemi.com
2 AMPERES, 25 VOLTS
R DS(on) = 250 m W
P ? Channel
D
F2PO2
G
Features
? Ultra Low R DS(on) Provides Higher Efficiency and Extends Battery Life
? Logic Level Gate Drive ? Can Be Driven by Logic ICs
? Miniature SO ? 8 Surface Mount Package ? Saves Board Space
? Diode Is Characterized for Use In Bridge Circuits
? Diode Exhibits High Speed, with Soft Recovery
? I DSS Specified at Elevated Temperatures
? Avalanche Energy Specified
? Mounting Information for SO ? 8 Package Provided
? This is a Pb ? Free Device
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted) (Note 1)
Rating Symbol Value Unit
8
G
S
MARKING
DIAGRAM
8
SO ? 8, Dual
CASE 751 AYWW G
1 STYLE 11
1
F2P02 = Specific Device Code
A = Assembly Location
Y = Year
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Drain Current ? Continuous @ T A = 25 ° C
Drain Current ? Continuous @ T A = 100 ° C
Drain Current ? Single Pulse (t p ≤ 10 m s)
V DSS
V GS
I D
I D
I DM
25
± 20
2.5
1.7
13
Vdc
Vdc
Adc
Apk
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
Total Power Dissipation @ T A = 25 ° C
(Note 2)
Derate above 25 ° C
Operating and Storage Temperature Range
P D
T J , T stg
2.0
16
? 55 to 150
W
mW/ ° C
° C
Source ? 1
Gate ? 1
Source ? 2
1
2
3
8
7
6
Drain ? 1
Drain ? 1
Drain ? 2
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 20 Vdc, V GS = 10 Vdc, Peak
I L = 7.0 Apk, L = 10 mH, R G = 25 W )
E AS
245
mJ
Gate ? 2
4 5
Top View
Drain ? 2
Thermal Resistance, Junction ? to ? Ambient R q JA 62.5 ° C/W
(Note 2)
Maximum Lead Temperature for Soldering T L 260 ° C
Purposes, 0.0625 ″ from case for 10 sec.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Negative sign for P ? Channel device omitted for clarity.
2. Mounted on 2 ″ square FR4 board (1 ″ sq. 2 oz. Cu 0.06 ″ thick single sided) with
one die operating, 10 sec. max.
ORDERING INFORMATION
Device Package Shipping ?
MMDF2P02ER2G SO ? 8 2500 Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 9
1
Publication Order Number:
MMDF2P02E/D
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